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Thermal Modeling

  • Thermal modeling of semiconductor packages based on finite element analysis (FEA) or computational fluid dynamics (CFD) tools capable to introduce mechanical CAD data directly into the analysis.

Samples:

Temperature distribution in a special TO-Package
Temperature distribution in a special TO-Package
Thermal simulation of 16x Test Board
Thermal simulation of 16x Test Board
Thermal distribution in a VCSEL
Thermal distribution in a VCSEL